Earbud & Speaker Bonding

Better Adhesives, Better Acoustical Performance

KRYLEX® offers a wide range of assembly and protection materials for challenging and various acoustic application requirements. Our products are specifically designed to cover a broad spectrum of acoustic applications to meet the strict dispensing requirements while providing excellent performance, enhancing process efficiency, and lowering the total manufacturing cost to acoustic devices manufacturers.

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Speaker Solutions

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Bonding of Magnets

Bonding of Magnets

Magnet performance can negatively be impacted by high assembly process temperatures. KE1092 Series offer low-temperature thermal cure for high performance bonding of temperature sensitive components like batteries and magnets.

Potting/Encapsulation of Wires and Battery

Potting/Encapsulation of Wires and Battery

The batteries in the headphone stems have a potting adhesive that encapsulates the battery and adjacent wires. KB5002 and KD8011 offers best in class UV and Moisture cure performance for this kind of electronic component encapsulation.

Selective Encapsulation

Selective Encapsulation

There is a requirement to protect sensitive components on the flex circuit. KD7009 and KD8011 offers best in class UV + Moisture cure performance. KU5225 and KU5026 offer rapid UV Cure kinetics and excellent adhesion if no shadowed areas are present

Bonding of Flex Circuit

Bonding of Flex Circuit

KU5156 is a high peel strength UV cure adhesive for bonding flexible substrates. KU5026 also offers slightly high adhesion strength.

Bonding Battery to Antenna

Bonding Battery to Antenna

Application requires high-performance PUR that has optimized dielectric properties to bond antennas and adjacent components. KH9001 is formulated with specific dielectric properties to prevent antenna signal disruption when bonding the antenna itself or adjacent components.

Bonding of Microphone & Microspeaker

Bonding of Microphone & Microspeaker

KU5039A, KU5040 are UV Curable adhesives that have excellent performance at elevated temperatures ideal for bonding sensitive electronic components.

Bonding of Magnets

Magnet performance can negatively be impacted by high assembly process temperatures. KE1092 Series offer low-temperature thermal cure for high performance bonding of temperature sensitive components like batteries and magnets.

Potting/Encapsulation of Wires and Battery

The batteries in the headphone stems have a potting adhesive that encapsulates the battery and adjacent wires. KB5002 and KD8011 offers best in class UV and Moisture cure performance for this kind of electronic component encapsulation.

Selective Encapsulation

There is a requirement to protect sensitive components on the flex circuit. KD7009 and KD8011 offers best in class UV + Moisture cure performance. KU5225 and KU5026 offer rapid UV Cure kinetics and excellent adhesion if no shadowed areas are present

Bonding of Flex Circuit

KU5156 is a high peel strength UV cure adhesive for bonding flexible substrates. KU5026 also offers slightly high adhesion strength.

Bonding Battery to Antenna

Application requires high-performance PUR that has optimized dielectric properties to bond antennas and adjacent components. KH9001 is formulated with specific dielectric properties to prevent antenna signal disruption when bonding the antenna itself or adjacent components.

Bonding of Microphone & Microspeaker

KU5039A, KU5040 are UV Curable adhesives that have excellent performance at elevated temperatures ideal for bonding sensitive electronic components.

Acoustic Performance and Reliability

KRYLEX®  range of adhesives ensure excellent acoustic performance and consistency for a wide range of applications within speaker assembly. Whether a part of a larger assembly such as a tablet, phone or watch or a standalone device such as a wireless earbud, improving the quality of sound emitted has always been the driver for the next generation of speaker modules (microspeakers). The quality of the sound can be improved by specifying materials that provide good vibration damping characteristics. Earbuds or other devices tend to be regularly dropped, there must be some flexibility in the assembly to absorb this impact. They are also exposed to varying levels of temperature and moisture. Being able to withstand commonly found chemicals such as human sweat is a prerequisite for any speaker assembly

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