Adhering Two or More Substrates Together

Structural integrity is often the main requirement of an adhesive assembly and in real world conditions, large external peel or shear forces are often transmitted to the device’s exterior.In consumer electronics, rigid sub-assemblies such as enclosure or frame bonding must withstand a range of forces to protect a devices complex and often fragile components.

For example, the adhesion of Flexible Printed Circuits (FPC) onto an electronic assembly can create a high amount of peel force. In medical device assembly, dissimilar plastics are often adhered together in applications such as catheter and needle bonding. Some assemblies will require rigid joints that can maintain a high load, others will require that the adhesive joint is flexible to absorb the loads through such forces as torque and impact.

Some factors to consider when engineering adhesive solutions:

  • Curing speed
  • Chemical and Moisture Resistance
  • Shrinkage
  • Water Absorption
  • Re-workability
  • Viscosity
  • Thixotropy
  • Elongation

KRYLEX® adhesive technologies meet a wide range of requirements set by electronic device manufacturers. These technologies include UV curable acrylates, CAs, Epoxies and Polyurethane Reactive (PURs). Our range of adhesive solutions provide excellent adhesion on a wide range of materials, such as PC, PBT, LCP, nylon, ABS, PI, PET, FR4, and aluminium.

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