Hybrid & Dual Cure Chemistry
Krylex® Hybrid chemistries provide a broad range of benefit for applications which may involve shadowed areas. Our newest technology, KURA-LOW™ provides maximum flexibility in manufacturing process. The adhesive can be fully cured with either UV exposure or low temperature heat exposure or any combination of the two. UV+Moisture cure technologies allow for rapid fixture with UV exposure and full cure with exposure to ambient humidity.
KRYLEX® continues to push the limitations of material science. Where limits were found with traditional chemistry families, we achieved breakthrough with the KRYLEX® Hybrid range. Be it, acrylate, thiol-ene or epoxy-based technology, our products have a number unique cure mechanism based upon the application.
KRYLEX® Hybrid range can cure with any through the following mechanism (or combination of mechanism).
- Heat
- Moisture
- Light (broadband or LED)
- Microwave radiation
| KURA-LOW™ Dual Cure | Heat/UV | ||||||
|---|---|---|---|---|---|---|---|
| Product | Description | Typical Applications | Color | Viscosity，CPS | Hardness | Cure Condition | Shelf Life, months |
| KD7009 | Heat Cure as low as 60◦C, Low Shrinkage, High Thixotropy | Encapsulation of temperature sensitive components where full UV Exposure is not possible | Clear | 600 | 70D | 365nm LED | 6 |
| Dual Cure | UV + Moisture | *365nm LED, 30mW/cm2, 2500mJ | + 24 Hour Moisture Cure | |||
|---|---|---|---|---|---|---|
| Product | Description | Typical Applications | Color | Viscosity，CPS | Hardness | Shelf Life, months |
| KD8010 | Exceptional depth of cure / Opaque substrates possible | Encapsulation of temperature sensitive components where full UV exposure is not possible | Clear | 600 | 70D | 6 |
| KD8011 | Exceptional depth of cure / Opaque substrates possible | Encapsulation of temperature sensitive components where full UV exposure is not possible | Translucent | 2400 | 73D | 6 |
| KD5001 | Very active moisture cure, ideal if shadowing is high | Encapsulation of temperature sensitive components where full UV exposure is not possible | Translucent | 5400 | 55D | 6 |
| Low Temp Cure Epoxy | |||||||
|---|---|---|---|---|---|---|---|
| Product | Description | Color | Viscosity，CPS | Thixotropic Index | Cure Schedule | Work Life | Shelf Life, months |
| KE1092 | High Performance Die Attach | Beige | 3800 | 2.93 | 30 mins at 100◦C or 60 mins at 80◦C | 8 Hours | 1 Year @ -20◦c |