Polyurethane PUR Hot Melt Adhesives

PURs are solvent free, 100% solid adhesives which are applied in molten state and then crystalize on cooling. They provide green strength and instant fixation on part assembly. Over the course of the next several days, PUR hot melts further react with ambient moisture to increase in strength and environmental resistance until a fully cured, robust bond-line is created.

  • Very fast fixation for high-speed production
  • Single component formulations allow for flexible dispensing
    methods
  • Excellent adhesion to variety of porous and non-porous surfaces
  • Good gap filling capability for greater tolerances in part design
  • Ability for thin bond-line or dot dispensing in micro applications
  • Excellent moisture and chemical resistance
  • Excellent durability and impact resistance for tough yet flexible
    bonds
  • Stable formulations with good shelf life

Traditionally, polyurethane (PUR) hot melt adhesives have been used in high-volume, low-cost applications such as panel laminating, book binding, woodworking and furniture manufacture and even kitchen sponge assembly. These products have stood the test of time because of their ease of use and durability in these applications. Chemence® has taken the formulation of PUR reactive hot melt adhesives a step further by customizing these products to fit the rigorous requirements of electronics manufacturers while maintaining the important benefits that have been outlined above with regards to performance and ease of processing. Our polyurethane hot melt adhesives for electronics are available in syringes and cartridges to fit many existing electronics production lines. In the electronics market, structural adhesives are being utilized more and more in place of mechanical fastening methods and tapes due to their high strength, ease of use and low total cost of ownership. Polyurethane hot melts are becoming one of the most popular adhesives selected by electronics manufacturers, owing to their wide range of benefits.

Since they are available in different viscosities, colors, adhesion and impact properties, and several other specifications, choosing the right polyurethane hot melt adhesives holds a great significance. Get in touch with Chemence®, a market leader in the development of polyurethane hot melts for the electronics industry. Our KRYLEX® polyurethane hot melts come in a variety of formulations to meet the requirements of your application and we are more than willing to work on customizing a formula specifically for your needs.

Featured Product
ProductDescriptionTypical ApplicationsDispense
Temperature,
◦C
Open Time,
mins
Cure Time –
Ambient
Moisture,Hrs
HardnessElongation
at Break,
%
KH9001Low MVTR/ High Reliability/Low
dielectric constant (2.1) and loss tangent (0.01) / Excellent Chemical Resistance/ High Bio content/ Dispensible PSA
Antenna bonding120107273A>500
KH9005Outstanding Barrier Sealant – Low
MVTR/ High Reliability/ Low dielectric
constant/ Excellent Chemical
Resistance/ Low Bubble formation/
High Bio content/ Dispensible PSA
Barrier Sealant/
Encapsulant
1202-47271A>800
KH9005iOutstanding Barrier Sealant – with
Ultra low bondline bubble formation
Barrier Sealant/
Encapsulant
1202-41687A>500
KH9012Moisture cure PUR with excellent jettabilityHigh UPH assembly processes1203-645D>800
KH106BExcellent for bonding Metal to PlasticEnclosure Bonding105-1205-1024>500
KH107Very High Impact Performance/
Excellent Adhesion to plastics and
metals/ Medium Green strength
Flexible substrate
bonding – High
Peel force bonds –
wire fixing, flex circuit
High Impact
applications
bonding metals –
Tablet Stylus
100-1302-434D>400
KH108BExcellent Adhesion to metal and
Plastic excellent Temperature and
Chemical Resistance
Enclosure Bonding100-1305-1024>500
KH112BExcellent Adhesion to metal and
Plastic excellent Temperature and
Chemical Resistance
Enclosure Bonding100-1305-1024>500
KH168-1Excellent Adhesion to metal and
Plastic excellent Temperature and
Chemical Resistance
Enclosure Bonding100-1305-1024>800
KH195Excellent adhesion to metal and
glass and fast cure
Enclosure Bonding100-1302-41224D>600
KH202Excellent Adhesion to PC, PA and
Metal, Easy Re-work
Enclosure Bonding90-120324>600
KH813FExcellent adhesion to plastics and
metals/ Excellent solvent resistance/
Excellent Temperature cycle
performance/Low application temperature
Enclosure Bonding90-1202-47229D>500
KH911FExcellent adhesion to plastics and
metals/ Excellent solvent resistance/
Excellent Temperature cycle
performance/ Low application
temperature
Enclosure Bonding90-12022431D>450
KH936FExcellent Adhesion to metal and
Plastic excellent Temperature and
Chemical Resistance
Enclosure Bonding –
Cell Phone Back Cover
100-1205-102424D>500
KH946FHigh Adhesion to glass, metal and
plastic
Enclosure Bonding95-1254-716843D>490
KH962FExcellent Adhesion to PC, PA and
Metal
Enclosure –
Cell Phone Touch Panel
95-1252-42433D>600
KH965Flexible / Medium Green StrengthBonding Ferrite-PC-PI
e.g. wireless charger
assembly
100-12052424D>500