Mobile Device
KRYLEX® Mobile Device Adhesives Drive Performance
The mobile device market is a growing and dynamic industry. Each year, manufacturers work to improve on previous generations of devices to respond to demanding customer needs. The assembly of mobile devices such as smartphones and tablets require dozens of different adhesives and sealants for structural assembly, environmental protection, thermal management, electrical conductivity, or insulation and more. KRYLEX® electronics adhesives and sealants excel in many of these applications.

Mobile Device Solutions
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Flexible Printed Circuit (FPC) Bonding
KRYLEX® reinforcement adhesives provide superior protection for flexible circuits used in electronics assemblies. KU5016 & KU5303 provide good adhesion and peel strength as well as high flexibility and crack resistance protect FPCs against damage.
Frame Bonding and Sealing
Structural adhesives combine high bond strength and fast fixture with low shrinkage, dense cross-linking and pressure resistance. KH9005 & KH9012 have excellent adhesion to plastic & glass, high impact strength and excellent reliability (Temperature Cycle Performance -40◦C to +80◦C for 1000 Hrs)
Entry Point Sealants
Mobile devices contain several vulnerable openings by design. KRYLEX® high performance sealants and encapsulants safeguard against moisture entry and allow for high ingress protection (IP) ratings. KU5026 is a fast UV Cure with excellent adhesion to HSE/ LSE plastics
COG/COF Bonding
KRYLEX® protect PCBs and components from shock, drop, vibration and impact. Our solutions provide strong adhesion, moisture resistance without compromising antenna capabilities or acoustic performance. KU5163 & KH9001 are easy to rework and have optimised dielectric properties
Component Gasketing
KRYLEX® offers a wide range of solutions with optimized rheology, durometer and compression set for gasketing of components in mobile devices. Our range of cure-in-place gaskets (CIPG) help to protect devices from water ingress and subsequent damage.
Flexible Printed Circuit (FPC) Bonding
KRYLEX® reinforcement adhesives provide superior protection for flexible circuits used in electronics assemblies. KU5016 & KU5303 provide good adhesion and peel strength as well as high flexibility and crack resistance protect FPCs against damage.
Cover Glass Bonding
Structural adhesives for cover glass bonding combine high adhesion strength and impact resistance. reworkable materials allow customers to lower the total cost of ownership in their manufacturing processes. KH9005 & KH9012 have excellent adhesion to glass and ceramic.
Frame Bonding and Sealing
Structural adhesives combine high bond strength and fast fixture with low shrinkage, dense cross-linking and pressure resistance. KH9005 & KH9012 have excellent adhesion to plastic & glass, high impact strength and excellent reliability (Temperature Cycle Performance -40◦C to +80◦C for 1000 Hrs)
Entry Point Sealants
Mobile devices contain several vulnerable openings by design. KRYLEX® high performance sealants and encapsulants safeguard against moisture entry and allow for high ingress protection (IP) ratings. KU5026 is a fast UV Cure with excellent adhesion to HSE/ LSE plastics
COG/COF Bonding
KRYLEX® protect PCBs and components from shock, drop, vibration and impact. Our solutions provide strong adhesion, moisture resistance without compromising antenna capabilities or acoustic performance. KU5163 & KH9001 are easy to rework and have optimised dielectric properties
Component Gasketing
KRYLEX® offers a wide range of solutions with optimized rheology, durometer and compression set for gasketing of components in mobile devices. Our range of cure-in-place gaskets (CIPG) help to protect devices from water ingress and subsequent damage.

KRYLEX® Adhesives Custom formulated for You
KRYLEX® has extensive experience in customizing formulations to meet specific mobile device requirements. Our range of mobile device adhesives and sealants provide critical performance benefits to smartphone and tablet manufacturers. KRYLEX® adhesive solutions deliver:
- High adhesion to most substrates
- Excellent chemical and moisture resistance
- Fast curing fixturing and curing speeds
- Superior tensile properties and impact resistance
- Low total cost of ownership
- Reliable performance and quality
- Multiple viscosities available
- One-part formulations – no mixing or diluting
- Solvent free