KD7009 Camera Module Active-Alignment Adhesive
KRYLEX® KD7000 series is hybrid adhesive that utilizes Chemence® patented KURA-LOW technology. KURA-LOW enables heat curing at low temperatures which is important when using heat sensitive substrates e.g., LCP/ PC/ Anodized Al/ OLED panels. KD7000 series can cure at an industry leading 60°C.
A highly room temperature (RT) stabilized, LTC epoxy adhesive chemistry enabling long product work on the production line (weeks) that can cure at temperatures between 60~80◦C
- Low shrinkage
- No frozen storage
- Long work life at RT
- High adhesion to plastic and metal substrates
- Can be made dual cure capable e.g., Active Alignment (A.A.)
Sustainability Value Proposition for KURA-LOW
- Lower processing Temperatures – Reduced energy consumption/ Low risk for Heat sensitive substrates and materials. Cure @ 60◦C
- No frozen storage (Reduced energy consumption)
KD7009 At A Glance
Low Temp Cure (70°C), Long Pot Life, No Frozen Storage
CURE TIME 2s @365nm 2,000 mW/cm2
WATER ABSORPTION 24hrs @ 25◦C
WATER ABSORPTION 24hrs @ 100◦C
SHEER STRENGTH PC/LCP [2s @365nm]
GLASS TRANSITION DSC 10◦C/min
Low Temperature Curability
LOW TEMPERATURE CURE
KD7009 cures in 30mins at 800C or 60 mins at 600C. The secondary heat cure allows full cure even in shadowed areas.
KD7009 is a highly tunable product and can be modified for the percise application.
KD7009 is room-temperature stable and does not require cold storage. This allows easier process and workflows in the production environment.