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Benefits of High Glass Transition, ‘Tg’, Adhesives for Enhanced Reliability Electronic Device Assembly
KRYLEX High Tg Platform – KE9000 Series Introduction: The choice of which adhesive to select for a specific electronic application depends upon a number of different and specific requirements. Some properties are physical in nature e.g. Viscosity and thixotropic index, pot life, shelf life, etc. Other factors to consider in relation to the adhesive are […]
Posted by Andy Lard on April 3, 2026
High Performance, Dual Cure, ‘B Stage’ Adhesives for Electronic Device Assembly
Thermosetting adhesive systems are cross linked (cured) by a reaction with a designated stimulus. Adhesive curing is categorised into 3-stages: Adhesive B-Stage: B-stageable adhesive systems offer significant manufacturing advantages, including flexible processing, reduced waste, and improved precision. These types of adhesives are partially cured before final assembly, allowing for staged production and better control. There […]
Posted by Andy Lard on March 13, 2026
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