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Benefits of High Glass Transition, ‘Tg’, Adhesives for Enhanced Reliability Electronic Device Assembly
KRYLEX High Tg Platform – KE9000 Series Introduction: The choice of which adhesive to select for a specific electronic application depends upon a number of different and specific requirements. Some properties are physical in nature e.g. Viscosity and thixotropic index, pot life, shelf life, etc. Other factors to consider in relation to the adhesive are […]
Posted by Andy Lard on April 3, 2026
High Performance, Dual Cure, ‘B Stage’ Adhesives for Electronic Device Assembly
Thermosetting adhesive systems are cross linked (cured) by a reaction with a designated stimulus. Adhesive curing is categorised into 3-stages: Adhesive B-Stage: B-stageable adhesive systems offer significant manufacturing advantages, including flexible processing, reduced waste, and improved precision. These types of adhesives are partially cured before final assembly, allowing for staged production and better control. There […]
Posted by Andy Lard on March 13, 2026
KRYLEX Electrically Conductive Adhesives for Electronic Device Assembly
As consumer electronic devices are required to run at ever-increasing power densities, the Increasing power usage presents several challenges. Two such applications that are seeing significant increases in power usage are Compact Camera modules (CCM) and high-resolution OLED Displays. These challenges require innovative solutions in power management, thermal design, and signal processing to ensure that […]
Posted by Krylex on July 7, 2025
NextGen Camera Module adhesives: IR Filter bonding
Our electronic devices and automobiles have seen a dramatic increase in the number of Compact Camera Modules (CCMs) integrated into their assembly. For our mobile devices, the continuous integration of CCMs has resulted in exceptional clarity over a wide range of distances. The emergence of Advanced Driver Assistance Systems (ADAS) in the automotive industry has […]
Posted by Krylex on October 20, 2021
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